Given that many companies are producing advanced chips, but no company has yet built a fully reusable rocket or reached SpaceX's scale, I believe Starship is even more challenging, but we'll have to wait and see.
Terafab will technically consist of two wafer fabs, each producing only one chip design. This significantly simplifies the process flow and allows FOUPs (first-item manufacturing units) to move more linearly and compactly.
The extremely high throughput allows us to quickly test which steps can be eliminated, simplified, or accelerated, even after the design is finalized. Current wafer fabs are very conservative, following rigid rules of historical experience, which are mostly correct, but not all.
Any factor limiting machine performance means the machine will have to be redesigned unless it has reached its physical limits.
Developing new iterations of chip designs produced daily at wafer fabs (with a latency of less than 7 days) means we can try many high-risk, high-reward ideas.
Wait a minute
In any case, there is no other way to achieve maximum scale, so either we build Terafab, or we are stuck at the current industry growth rate of about 20% per year for chip/memory production.